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Patent Searching and Data


Title:
【発明の名称】半導体集積回路
Document Type and Number:
Japanese Patent JP2752059
Kind Code:
B2
Inventors:
SHIMA TAKESHI
SAKUI YASUSHI
Application Number:
JP174887A
Publication Date:
May 18, 1998
Filing Date:
January 09, 1987
Export Citation:
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Assignee:
TOSHIBA KK
International Classes:
H01L21/822; H01L27/04; (IPC1-7): H01L27/04; H01L21/822
Domestic Patent References:
JP5913364A
JP5982762A
JP59217352A
JP60117655A
JP61193467A
JP61156751A
JP6143445A
JP6021543A
JP59175148A
JP59135747A
JP58164242A
JP58143550A
JP53140983A
Attorney, Agent or Firm:
Togawa Hideaki