Title:
【発明の名称】半導体集積回路
Document Type and Number:
Japanese Patent JP2752059
Kind Code:
B2
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Inventors:
SHIMA TAKESHI
SAKUI YASUSHI
SAKUI YASUSHI
Application Number:
JP174887A
Publication Date:
May 18, 1998
Filing Date:
January 09, 1987
Export Citation:
Assignee:
TOSHIBA KK
International Classes:
H01L21/822; H01L27/04; (IPC1-7): H01L27/04; H01L21/822
Domestic Patent References:
| JP5913364A | ||||
| JP5982762A | ||||
| JP59217352A | ||||
| JP60117655A | ||||
| JP61193467A | ||||
| JP61156751A | ||||
| JP6143445A | ||||
| JP6021543A | ||||
| JP59175148A | ||||
| JP59135747A | ||||
| JP58164242A | ||||
| JP58143550A | ||||
| JP53140983A |
Attorney, Agent or Firm:
Togawa Hideaki