【発明の名称】半導体集積回路装置

Title:

【発明の名称】半導体集積回路装置

Document Type and Number:

Japanese Patent JP2874254

Kind Code:

B2

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Inventors:

ISONO TOSHIO

Application Number:

JP5409690A

Publication Date:

March 24, 1999

Filing Date:

March 05, 1990

Export Citation:

Assignee:

NIPPON DENKI KK

International Classes:

H01L21/82; H01L27/118; (IPC1-7): H01L21/82; H01L27/118

Domestic Patent References:

Attorney, Agent or Firm:

Naoki Kyomoto (2 outside)

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