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Title:
【発明の名称】半導体基板のレジスト処理装置
Document Type and Number:
Japanese Patent JP2877744
Kind Code:
B2
Inventors:
USHIJIMA MITSURU
AKUMOTO MASAMI
HIRAKAWA OSAMU
KIMURA YOSHIO
Application Number:
JP30222695A
Publication Date:
March 31, 1999
Filing Date:
October 27, 1995
Export Citation:
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Assignee:
TOKYO EREKUTORON KK
International Classes:
H01L21/677; G03F7/20; H01L21/027; (IPC1-7): H01L21/68; H01L21/027
Domestic Patent References:
JP5227367A
JP52154370A
JP5369582A
JP62199469A
JP57149748A
JP6313332A
Attorney, Agent or Firm:
富田 幸春