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Patent Searching and Data


Title:
【発明の名称】半導体ウエハーの加熱処理装置
Document Type and Number:
Japanese Patent JP2877748
Kind Code:
B2
Inventors:
OGINO KOZO
TANAKA YOZO
KIDA IKUYOSHI
Application Number:
JP7129796A
Publication Date:
March 31, 1999
Filing Date:
February 29, 1996
Export Citation:
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Assignee:
NIPPON PIRAA KOGYO KK
International Classes:
C30B35/00; C23C14/50; H01L21/205; H01L21/22; H01L21/31; H01L21/68; H01L21/683; (IPC1-7): H01L21/31; C23C14/50; H01L21/205; H01L21/22; H01L21/68
Domestic Patent References:
JP641225A
JP60189219A
JP758036A
Attorney, Agent or Firm:
渡邊 隆文