Title:
移動ステージ装置および半導体焼付け装置
Document Type and Number:
Japanese Patent JP3002142
Kind Code:
B2
Inventors:
伊藤 博仁
大石 伸司
大石 伸司
Application Number:
JP26567796A
Publication Date:
January 24, 2000
Filing Date:
October 07, 1996
Export Citation:
Assignee:
キヤノン株式会社
International Classes:
B23Q5/28; B23Q1/00; B23Q1/25; B23Q1/38; B23Q1/58; B23Q1/62; B23Q11/00; H01L21/68; (IPC1-7): B23Q1/62; B23Q5/28; B23Q11/00; H01L21/68
Domestic Patent References:
| JPH03142136A | ||||
| JPS62254681A | ||||
| JPS59115138A | ||||
| JPS6320014A |
Attorney, Agent or Firm:
若林 忠