Title:
半導体集積回路
Document Type and Number:
Japanese Patent JP3008469
Kind Code:
B2
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Inventors:
額田 泰明
Application Number:
JP25777590A
Publication Date:
February 14, 2000
Filing Date:
September 27, 1990
Export Citation:
Assignee:
日本電気株式会社
International Classes:
H01L21/8249; H01L21/82; H01L27/00; H01L27/06; H01L27/118; H03K19/01; H03K19/08; H03K19/173; (IPC1-7): H03K19/08
Attorney, Agent or Firm:
京本 直樹 （外２名）