Title:
【発明の名称】半導体装置の製造方法
Document Type and Number:
Japanese Patent JP3064897
Kind Code:
B2
Inventors:
Yukio Ikeda
Application Number:
JP6591196A
Publication Date:
July 12, 2000
Filing Date:
March 22, 1996
Export Citation:
Assignee:
Kansai NEC Corporation
International Classes:
H01L21/768; H01L21/265; H01L29/78; (IPC1-7): H01L29/78; H01L21/768
Domestic Patent References:
| JP27531A | ||||
| JP2111031A |