Title:
携帯電話端末ハウジングのセラミックモジュール化構造
Document Type and Number:
Japanese Patent JP3133395
Kind Code:
U
Inventors:
Sen Seyo
Application Number:
JP2007002031U
Publication Date:
July 12, 2007
Filing Date:
March 26, 2007
Export Citation:
Assignee:
Sen Seyo
International Classes:
H04M1/02; H04M1/21
Attorney, Agent or Firm:
Patent business corporation Ota patent office
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