Title:
【発明の名称】多層配線板およびその製造方法
Document Type and Number:
Japanese Patent JP3329756
Kind Code:
B2
Inventors:
Akira Yonezawa
Hidehisa Yamazaki
Hidehisa Yamazaki
Application Number:
JP647899A
Publication Date:
September 30, 2002
Filing Date:
January 13, 1999
Export Citation:
Assignee:
Yamaichi Electric Co., Ltd.
International Classes:
H05K3/46; H05K1/11; H05K3/40; (IPC1-7): H05K3/46; H05K1/11; H05K3/40
Domestic Patent References:
| JP10190231A | ||||
| JP10335528A | ||||
| JP6244554A |
Attorney, Agent or Firm:
Saichi Suyama