Title:
半導体集積回路装置の製造方法
Document Type and Number:
Japanese Patent JP3567377
Kind Code:
B2
Abstract:
To make diffusion preventing films adhere surely to the inner walls of a mutual connection recessed part by a low-temperature process in a semiconductor integrated circuit device, and to provide the manufacturing method.
The mutual connection recessed part connecting upper and lower electrodes is filled with mutual connection conductors 3, consisting of metal whose resistance is lower than polycrystalline silicon including impurity; the diffusion-preventing films 4, consisting of electroless plating films are arranged between the inner walls of the mutual connection recessed part and the mutual connection conductors 3.
COPYRIGHT: (C)2003,JPO
Inventors:
Shoso Shingubara
Tomoyuki Baba
Akihiko Furuya
Wang Mashibayashi
Keiichiro Yasuda
Hideo Ikeda
Muneaki Hagiwara
Tomoyuki Baba
Akihiko Furuya
Wang Mashibayashi
Keiichiro Yasuda
Hideo Ikeda
Muneaki Hagiwara
Application Number:
JP2002002683A
Publication Date:
September 22, 2004
Filing Date:
January 09, 2002
Export Citation:
Assignee:
Japan Science and Technology Agency
Kumabo Metal Co., Ltd.
Toppan Printing Co., Ltd.
Ogata Industry Co., Ltd.
Noda City Electronics Co., Ltd.
Kumabo Metal Co., Ltd.
Toppan Printing Co., Ltd.
Ogata Industry Co., Ltd.
Noda City Electronics Co., Ltd.
International Classes:
H01L21/28; H01L21/288; H01L21/3205; H01L23/12; H01L23/52; H01L25/065; H01L25/07; H01L25/18; H01L27/00; (IPC1-7): H01L21/3205; H01L21/288; H01L23/12; H01L25/065; H01L25/07; H01L25/18; H01L27/00
Domestic Patent References:
| JP2001355074A | ||||
| JP2001164375A | ||||
| JP2001332558A | ||||
| JP2002170904A | ||||
| JP11345933A |
Attorney, Agent or Firm:
Manabe Kiyoshi