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Title:
半導体装置の製造方法
Document Type and Number:
Japanese Patent JP3574040
Kind Code:
B2
Inventors:
Hiroyuki Zhang
Hideki Uochi
Toru Takayama
Shunpei Yamazaki
Yasuhiko Takemura
Application Number:
JP2000123594A
Publication Date:
October 06, 2004
Filing Date:
April 25, 2000
Export Citation:
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Assignee:
Semiconductor Energy Laboratory Co., Ltd.
International Classes:
H01L21/20; H01L21/02; H01L21/336; H01L27/12; H01L29/786; (IPC1-7): H01L21/20; H01L21/336; H01L29/786
Domestic Patent References:
JP6244104A
JP45022173B1
JP2140915A
JP4186635A
JP61234027A
JP2199871A
Foreign References:



 
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