Title:
室温硬化性シリコーンエラストマー組成物
Document Type and Number:
Japanese Patent JP3614958
Kind Code:
B2
Abstract:
A room temperature curing silicone elastomer composition, with superior workability before curing, and which forms a silicone elastomer of a low modulus and high elongation after curing is described herein. This composition is prepared from (A) a diorganopolysiloxane, having both terminals of the molecular chains blocked by silanol groups, a diorganopolysiloxane having one terminal of the molecular chain blocked by a silanol group and the other terminal blocked by a trialkylsiloxy group, (B) an organosilane, (C) an organopolysiloxane resin, (D) a curing catalyst and (E) a higher fatty acid.
Inventors:
Seiji Hori
Hidekatsu Hatanaka
Hidekatsu Hatanaka
Application Number:
JP33400395A
Publication Date:
January 26, 2005
Filing Date:
November 29, 1995
Export Citation:
Assignee:
Toray Dow Corning Silicone Co., Ltd.
International Classes:
C09K3/10; C08K5/09; C08K5/5415; C08K5/5419; C08L83/04; C08L83/06; (IPC1-7): C08L83/06; C08K5/09; C08K5/5415; C09K3/10
Domestic Patent References:
| JP4013767A | ||||
| JP49035813B1 | ||||
| JP50032253A | ||||
| JP53034855A | ||||
| JP4126768A | ||||
| JP4253768A | ||||
| JP61225250A | ||||
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| JP8034922A |