マイクロチップ用基板とその接合方法並びにマイクロチップ - Kanagawa Academy of Science and Technology

Title:

マイクロチップ用基板とその接合方法並びにマイクロチップ

Document Type and Number:

Japanese Patent JP4033670

Kind Code:

B2

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Inventors:

Takehiko Kitamori
Akihide Hihara
Keiji Towa
Uchiyama Kenji

Application Number:

JP2001379233A

Publication Date:

January 16, 2008

Filing Date:

December 12, 2001

Export Citation:

Assignee:

Kanagawa Academy of Science and Technology

International Classes:

B01J19/00; C04B37/00; G01N37/00

Domestic Patent References:

Attorney, Agent or Firm:

Toshio Nishizawa

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