Title:
ガラスセラミック焼結体および多層配線基板
Document Type and Number:
Japanese Patent JP4057853
Kind Code:
B2
Inventors:
Fukuda Kenjiro
Application Number:
JP2002186856A
Publication Date:
March 05, 2008
Filing Date:
June 26, 2002
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
C04B35/16; C04B35/46; H01B3/02; H01B3/12; H05K1/03; H05K3/46
Domestic Patent References:
| JP2002047059A | ||||
| JP2001342057A |