Title:
ボード製品の成形方法及びそれに用いる成形装置
Document Type and Number:
Japanese Patent JP4110770
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To simultaneously perform molding of a board substrate by heating/ compression of a fiber mat and adhesion of a skin material to the board substrate, and to secure a skin piece used for being entangled in the opening part of the board substrate. SOLUTION: In a method for molding a board product by molding the board substrate 14 having a predetermined shape by heating and compressing the fiber mat and bonding the skin material 16 to the board substrate, the ski material 16 is cut at a part corresponding to a place where the opening must be formed to the board substrate 14 to form the skin piece 18. Then, the opening part is formed to the board substrate 14 by the cutting blade provided at a position protruded from the skin piece 18. Further, the skin material 16 is bonded to the surface of the board substrate 14 simultaneously with the molding of the board substrate 14 and the skin piece 18 is subsequently involved toward the rear side of the board substrate 14 so as to cover the edge of the opening.
More Like This:
Inventors:
Hitoshi parta
Yasushi Nagatani
Isao Takeuchi
Noriyuki Asai
Yasushi Nagatani
Isao Takeuchi
Noriyuki Asai
Application Number:
JP2001373364A
Publication Date:
July 02, 2008
Filing Date:
December 06, 2001
Export Citation:
Assignee:
Toyota Boshoku Co., Ltd.
International Classes:
B29C43/18; B60R13/02; B29C43/34; B29C43/40; B29K103/00
Domestic Patent References:
| JP11320591A | ||||
| JP9277197A | ||||
| JP5050513A | ||||
| JP59138451A | ||||
| JP63199628A | ||||
| JP10180781A |
Attorney, Agent or Firm:
Hidehiko Okada
Tetsuo Fukuda
Atsuko Nakamura
Tetsuo Fukuda
Atsuko Nakamura