Title:
遅延粘着剤
Document Type and Number:
Japanese Patent JP4223117
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain a delayed adhesive that is non-adhesive, while it is stored, and develops the pressure-sensitive adhesion caused by breakage of the molecular chain, when it is used by adding a cross-linking compound to the starting monomer or the polymer therefrom. SOLUTION: To 100 pts.wt. of a starting monomer, for example, a (meth) acrylic alkyl ester bearing 2-14C alkyl group, for example, lauryl methacrylate or its polymer, are added 0.3-100 pts.wt., preferably 0.5-50 pts.wt., more preferably 0.8-30 pts.wt. of a crosslinking compound bearing a radically polymerizable unsaturated group, for example, an epoxy group, an isocyanate group or the like or a cross linkable compound bearing no radically polymerizable unsaturated group, for example, pentaerythritol or the like to obtain the objective delayed pressure-sensitive adhesive that manifests adhesion properties by the breakage of molecular chains with irradiation of electromagnetic waves or with electron beams. The delayed adhesion product is given by providing the layer of this pressure-sensitive adhesive on the base material.
Inventors:
Shoji Otani
Application Number:
JP37303998A
Publication Date:
February 12, 2009
Filing Date:
December 28, 1998
Export Citation:
Assignee:
Kao Corporation
International Classes:
C09J7/02; C09J129/12; C08F8/50; C08F20/12; C08F290/06; C09J9/00; C09J129/10; C09J131/02; C09J133/04
Domestic Patent References:
| JP49093481A | ||||
| JP10213790A |
Attorney, Agent or Firm:
Satoshi Furuya
Kaoru Furuya
Takahiko Mizobe
Shinji Mochida
Kaoru Furuya
Takahiko Mizobe
Shinji Mochida