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Title:
立体回路基板及び立体回路基板への撮像素子の実装方法
Document Type and Number:
Japanese Patent JP4269887
Kind Code:
B2
Abstract:

To provide a microwave circuit board which can be mounted with an imaging device without causing a large deformation and in which an optical characteristic of a light transmission part in an opening hole is not degraded.

The microwave circuit board 6 is disclosed, which is provided with at one side an imaging device mount part 2 for mounting the imaging device 1 and a lens support part 4 for supporting a lens 3 at the side opposite from the imaging device mount part 2, and wherein the opening hole 5 open to the imaging device mount part 2 and the lens support part 4 is formed. The opening hole 5 is provided with the light transmission part 7 formed by integrally forming an optical transparent material to clog the inside of the opening hole 5. Clogging the opening hole 5 with the light transmission part 7 can reinforce the part of the opening hole 5. Further, the optical transparent material is integrally formed in the opening hole 5 to be able to form the light transmission part 7 after the microwave circuit board 6 is formed, so that a forming pressure and a stress of curing contraction caused when the microwave circuit board 6 is formed do not act on the light transmission part 7.

COPYRIGHT: (C)2005,JPO&NCIPI


Inventors:
Toshiyuki Suzuki
Hirofumi Yamanaka
Shinobu Kida
Yoshiharu Sanagawa
Application Number:
JP2003367456A
Publication Date:
May 27, 2009
Filing Date:
October 28, 2003
Export Citation:
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Assignee:
Panasonic Electric Works Co., Ltd.
International Classes:
G02B3/00; H01L21/60; H01L27/14; H04N5/225; H04N5/335; H04N101/00
Domestic Patent References:
JP2002198502A
JP2001245186A
JP2003168793A
JP4083222A
JP2000323692A
JP2003037758A
JP11164209A
JP7177301A
JP2003078121A
Attorney, Agent or Firm:
Keisei Nishikawa
Atsuo Mori