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Title:
半導体装置およびそれを備えた光学装置用モジュール
Document Type and Number:
Japanese Patent JP4384202
Kind Code:
B2
Abstract:
A solid-state imaging device 1 is arranged so that a hollow section 9 is formed between a solid-state imaging element 2 and a covering section 4 and an air path 7 is formed in an adhesive section 5 so as to extend from the hollow section 9 to the outside, wherein the adhesive section 5 is formed so as not to be positioned on a signal processing section 8 for processing a signal of the solid-state imaging element 2. This makes it possible to reduce noises occurring in the signal processing section of the semiconductor element while preventing occurrence of condensation in the covering section for covering the semiconductor element.

Inventors:
Kazuya Fujita
Kiyoshi Kumada
Application Number:
JP2007146190A
Publication Date:
December 16, 2009
Filing Date:
May 31, 2007
Export Citation:
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Assignee:
Sharp Corporation
International Classes:
H01L23/02; H01L27/14; H04N5/225
Domestic Patent References:
JP4239759A
JP2004031939A
JP2004146946A
JP2005322809A
JP2006310859A
Attorney, Agent or Firm:
Kenzo Hara International Patent Office



 
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