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Patent Searching and Data


Title:
モジュール構造体
Document Type and Number:
Japanese Patent JP4407858
Kind Code:
B2
Inventors:
廣津留 秀樹
寺崎 隆一
Application Number:
JP2000216024A
Publication Date:
February 03, 2010
Filing Date:
July 17, 2000
Export Citation:
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Assignee:
電気化学工業株式会社
International Classes:
H01L23/12; H01L23/36
Domestic Patent References:
JP10335538A
JP3503784A