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Patent Searching and Data


Title:
半導体装置および基板
Document Type and Number:
Japanese Patent JP4407860
Kind Code:
B2
Inventors:
宮田 修
岸本 一郎
Application Number:
JP2000237008A
Publication Date:
February 03, 2010
Filing Date:
August 04, 2000
Export Citation:
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Assignee:
ローム株式会社
International Classes:
H01L23/28; H01L23/12
Domestic Patent References:
JP10189790A
Attorney, Agent or Firm:
山田 義人