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Patent Searching and Data


Title:
基板にMEMSとICを組付ける方法およびMEMSデバイスの製造方法
Document Type and Number:
Japanese Patent JP4471673
Kind Code:
B2
Inventors:
スニル ウィクラマナヤカ
村尾 幸信
Application Number:
JP2004024095A
Publication Date:
June 02, 2010
Filing Date:
January 30, 2004
Export Citation:
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Assignee:
キヤノンアネルバ株式会社
International Classes:
B81C3/00; B81B7/00; B81C1/00
Domestic Patent References:
JP10090299A
JP8031976A
JP3094169A
JP11044704A
JP7128357A
JP2002036200A
JP2006519111A
Foreign References:
US20040016995
Attorney, Agent or Firm:
田宮 寛祉