Title:
基板処理装置、基板洗浄乾燥装置、基板処理方法、および、基板処理プログラム
Document Type and Number:
Japanese Patent JP4476330
Kind Code:
B2
Abstract:
Provided is a downsized substrate cleaning/drying apparatus (23) which can excellently dries a substrate (2). The substrate cleaning/drying apparatus performs cleaning process and drying process to the substrate. The apparatus is provided with a processing bath (34), which can store the substrate in an opened inner section and performs cleaning process and drying process to the stored substrate by using a cleaning solution held inside; a cover (89) which can close the processing bath; and a shielding mechanism (65) which is arranged between the processing bath and the cover and shields the inner surface of the cover that faces the inside of the processing bath when the cover closes the processing bath. In the apparatus, the cover closes the processing bath at the time of performing drying process to the substrate in the processing bath, and the shielding mechanism shields the inner surface of the cover at the time of performing cleaning process to the substrate in the processing bath.
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Inventors:
Yuji Kamikawa
Application Number:
JP2007546400A
Publication Date:
June 09, 2010
Filing Date:
November 10, 2006
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
H01L21/304; F26B9/06; F26B21/14
Domestic Patent References:
| JP11176796A | ||||
| JP11347501A | ||||
| JP2002313772A | ||||
| JP4152525A | ||||
| JP2003045843A | ||||
| JP9275089A |
Attorney, Agent or Firm:
Kenji Yoshitake
Hiroyuki Nagai
Junpei Okada
Yukihiro Hotta
Hiroyuki Nagai
Junpei Okada
Yukihiro Hotta