Title:
固体撮像素子の取付板及びその取付板への取付方法
Document Type and Number:
Japanese Patent JP4477811
Kind Code:
B2
Abstract:
The device has an opening with at least one first edge section fixing a first part of the opening circumference and at least one second edge section determining a second part of the opening circumference. The first and second edge sections extend along the outline of the light reception surface and so form reference lines for positioning the imaging device above the opening. AN Independent claim is also included for the following: a method of attaching a solid state imaging device with a light reception surface to a mounting plate.
Inventors:
Ken Hiranuma
Keiichi Hotta
Goji Funatsu
Keiichi Hotta
Goji Funatsu
Application Number:
JP2002051096A
Publication Date:
June 09, 2010
Filing Date:
February 27, 2002
Export Citation:
Assignee:
HOYA CORPORATION
International Classes:
H01L27/14; G03B17/00; H01L27/146; H01L31/0203; H04N5/225; H04N5/335; H04N5/372
Domestic Patent References:
| JP2001285722A |
Attorney, Agent or Firm:
Takashi Matsuura
Takuya Fuji
Taro Ushio
Takuya Fuji
Taro Ushio