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Patent Searching and Data


Title:
低温ヒートシール性ポリプロピレン系フィルム
Document Type and Number:
Japanese Patent JP4491945
Kind Code:
B2
Inventors:
久米 孝典
木代 茂樹
Application Number:
JP2000299331A
Publication Date:
June 30, 2010
Filing Date:
September 29, 2000
Export Citation:
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Assignee:
住友化学株式会社
International Classes:
C08J5/18; C08L53/00; B32B27/32; C08F297/08
Domestic Patent References:
JP2002069143A
JP2002088170A
JP9188789A
Attorney, Agent or Firm:
中山 亨