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Patent Searching and Data


Title:
素子実装方法および画像表示装置の製造方法
Document Type and Number:
Japanese Patent JP4491948
Kind Code:
B2
Abstract:
A device mounting method capable of efficiently, accurately arraying micro-devices on a circuit board is provided. The method includes a device separating step of separating a plurality of LED chips, which have been arrayed with a specific period on a wafer, into individual LED chips while keeping the arrayed state of the LED chips as it is, a device re-arraying step of handling the individually separated LED chips so as to re-array the LED chips at intervals of a value equivalent to the period multiplied by a specific magnification, and a device transferring step of transferring the re-arrayed LED chips on a mounting board while keeping the re-arrayed state of the LED chips as it is.

Inventors:
Toyoji Ohata
Application Number:
JP2000307615A
Publication Date:
June 30, 2010
Filing Date:
October 06, 2000
Export Citation:
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Assignee:
ソニー株式会社
International Classes:
G09F9/33; H01L21/52; H01L25/18; H01L21/301; H01L25/04; H01L33/00; H01L33/48; H04N9/30; G09G3/32; H01L25/075; H04N5/66
Domestic Patent References:
JP11142878A
JP11307878A
JP57052143A
JP7030209A
JP56017385A
Attorney, Agent or Firm:
Koichi Mori
Masaaki Yoshii
Takahisa Yamamoto