Title:
クッション体及びクッション体充填用発泡樹脂粒子
Document Type and Number:
Japanese Patent JP4505224
Kind Code:
B2
Abstract:
A cushioning body and expanded resin beads for filling in cushioning body capable of solving such a problem that, when the cushioning bodies such as a bed, a mattress, a pillow, a cushion etc. are used for performing a cushioning function, noise is generated each time the cushioning bodies are moved to provide uncomfortable feeling to users or awake the users while asleep, wherein expanded resin beads with a specified average particle size containing a specified amount of fluidization accelerator are used as the filler for the cushioning body.
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Inventors:
Yoshinobu Ishida
Tadaatsu Ueno
Yasuhiro Sakoda
Tadaatsu Ueno
Yasuhiro Sakoda
Application Number:
JP2003535594A
Publication Date:
July 21, 2010
Filing Date:
October 11, 2002
Export Citation:
Assignee:
Sekisui Plastics Co., Ltd.
Sankyo Corporation
Sankyo Corporation
International Classes:
A47C27/00; A47C27/12; A47C27/14; A47G9/10; B68G3/00
Domestic Patent References:
JP200093258A | ||||
JP11255945A | ||||
JP60195135A | ||||
JP2001181434A | ||||
JP11106548A | ||||
JP6163961U |
Attorney, Agent or Firm:
Shintaro Nogawa