To provide a pressure-sensitive adhesive that realizes both of contradictory properties of enhanced pressure-sensitive adhesive force and ready peelability, suppresses scattering of electronic components on dicing and exhibits large effects for suppressing static electricity when an electronic component is picked up, a pressure-sensitive adhesive sheet obtained using the same and a manufacturing method of electronic components using the pressure-sensitive adhesive sheet.

The pressure-sensitive adhesive comprises an elastomer having a halogen-containing monomer unit and a heat-polymerizable compound. The pressure-sensitive adhesive sheet is obtained using the same. The manufacturing method of the electronic component comprises using the pressure-sensitive adhesive sheet. The pressure-sensitive adhesive and the pressure-sensitive adhesive sheet are suitably employed for a pressure-sensitive adhesive sheet for fixing electronic components that is pasted on the back surface of an electronic component aggregate when a plurality of electronic component aggregates formed on a plate-like substrate is divided into a separate electronic component by dicing.

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