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Patent Searching and Data


Title:
半導体装置
Document Type and Number:
Japanese Patent JP4659534
Kind Code:
B2
Abstract:
A semiconductor device has a structure capable of connecting a lead terminal directly to an electrode on a front surface thereof. The semiconductor device includes a first main electrode provided on the front surface, a second main electrode provided on a back surface, and a metal film provided so as to cover at least a portion of a surface of the first main electrode and for soldering the lead terminal thereto. Here, the metal film includes a plurality of opening portions through which the surface of the first main electrode is exposed.

Inventors:
楢崎 敦司
Application Number:
JP2005194828A
Publication Date:
March 30, 2011
Filing Date:
July 04, 2005
Export Citation:
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Assignee:
三菱電機株式会社
International Classes:
H01L21/3205; H01L21/336; H01L21/60; H01L23/52; H01L29/41; H01L29/739; H01L29/78
Domestic Patent References:
JP2002252351A
JP2003229460A
JP6334009A
Attorney, Agent or Firm:
山田 卓二
田中 光雄
和田 充夫
石野 正弘
稲葉 和久