Title:
液状封止用エポキシ樹脂組成物及び電子部品装置
Document Type and Number:
Japanese Patent JP4696359
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain a liquid epoxy-resin composition wherein the surface of its cured material becomes a non-mirror face, and to provide an electronic parts device equipped with elements encapsulated by the same composition. SOLUTION: The liquid epoxy-resin composition for encapsulating is composed of, as essential components, (A) an epoxy resin and (B) a curing agent, wherein (B) the curing agent is composed of a phenol resin having an aryl group and further the reflection ratio of the surface of its cured material is 10% or below, and the electronic parts device is equipped with elements encapsulated by this liquid epoxy-resin composition for encapsulating.
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Inventors:
Toshito Takahashi
Hirokawa
Tsukahara Hisashi
Yasuaki Nakamura
Hirokawa
Tsukahara Hisashi
Yasuaki Nakamura
Application Number:
JP2000398598A
Publication Date:
June 08, 2011
Filing Date:
December 27, 2000
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
C08G59/62; C08K3/00; C08L63/00; H01L23/28; H01L23/29; H01L23/31
Domestic Patent References:
| JP9031167A | ||||
| JP2001298146A | ||||
| JP2001031740A | ||||
| JP8085719A | ||||
| JP8067805A | ||||
| JP8012745A | ||||
| JP2000169537A | ||||
| JP7173236A | ||||
| JP10251377A |
Attorney, Agent or Firm:
Hidekazu Miyoshi