Title:
ウェハ加工用テープ
Document Type and Number:
Japanese Patent JP4865926
Kind Code:
B1
Abstract:
Provided is a wafer working tape wherein a support substrate, an adhesion layer, and a single binding layer are stacked in this order. The binding layer is used for pressure adhesion of a semiconductor element to either an external contact wiring member with wiring or another semiconductor element. The difference in surface free energy between the face of the binding layer which has detached from the adhesion layer and the face of the binding layer which is not in contact with the adhesion layer is 10 mJ/m2 or less.
Inventors:
Masami Aoyama
Shinichi Ishiwata
Yabuki Akira
Kunihiko Ishiguro
Toshihiro Suzuki
Shinichi Ishiwata
Yabuki Akira
Kunihiko Ishiguro
Toshihiro Suzuki
Application Number:
JP2011141266A
Publication Date:
February 01, 2012
Filing Date:
June 24, 2011
Export Citation:
Assignee:
THE FURUKAW ELECTRIC CO.,LTD.
International Classes:
H01L21/301
Domestic Patent References:
| JP2007314636A | 2007-12-06 | |||
| JP2005342720A | 2005-12-15 |
Attorney, Agent or Firm:
Toshizo Iida
Naosuke Miyamae
Naosuke Miyamae