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Title:
マイクロデポジション装置
Document Type and Number:
Japanese Patent JP4880708
Kind Code:
B2
Abstract:
A microdeposition system ( 20 ) and method deposits precise amounts of fluid material onto a substrate. A microdeposition head ( 50 ) includes a plurality of spaced nozzles. A positioning device controls a position of the microdeposition head relative to the substrate. A controller ( 22 ) includes a positioning module that communicates with the positioning device and that generates position control signals for the positioning device. A nozzle firing module communicates with the microdeposition head ( 50 ) and selectively generates nozzle firing commands to define features of at least one layer of an electrical device, such as resistors, traces and capacitors on a printed circuit board, polymer light emitting diodes, and light panels.

Inventors:
Edwards, Chillards, Oh.
David, Albertari
Beerich, Howard Walter
James Middleton
Application Number:
JP2009014781A
Publication Date:
February 22, 2012
Filing Date:
January 26, 2009
Export Citation:
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Assignee:
ULVAC, Inc.
International Classes:
B05C5/00; B05C9/12; B05D1/26; B05C9/14; B05C11/00; B05C11/10; B05D3/00; B25B11/00; B29C67/00; B41J2/01; B41J2/04; B41J2/045; B41J2/05; B41J2/055; B41J3/407; B41J3/54; H01L21/00; H01L21/683; H01L23/12; H01L51/50; H05B33/10; H05K3/06; H05K3/12; H05K13/04; H05K1/02
Domestic Patent References:
JP10260307A
JP11077991A
Attorney, Agent or Firm:
Takao Hamano
Teruichi Hirai



 
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