Title:
レールボンド用低温溶接ろう
Document Type and Number:
Japanese Patent JP5104819
Kind Code:
B2
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Inventors:
Rikiya Kato
Exit Mutsumi
Yumiko Kaito
Fumio Kawakami
Murata Sandai
Kikuchi Norimitsu
Ryosuke Suyama
Exit Mutsumi
Yumiko Kaito
Fumio Kawakami
Murata Sandai
Kikuchi Norimitsu
Ryosuke Suyama
Application Number:
JP2009161769A
Publication Date:
December 19, 2012
Filing Date:
July 08, 2009
Export Citation:
Assignee:
Senju Metal Industry Co., Ltd.
Signal Equipment Co., Ltd.
Signal Equipment Co., Ltd.
International Classes:
B23K35/26; B23K1/00; C22C13/00; B23K101/26; B23K103/22
Domestic Patent References:
| JP2009043695A | ||||
| JP8267270A | ||||
| JP3028274B2 |
Attorney, Agent or Firm:
Shoichi Hirose