Title:
センサの運動方向に垂直な表面変動を検出するための非振動式接触電位差測定の較正
Document Type and Number:
Japanese Patent JP5188624
Kind Code:
B2
Abstract:
A method and system for determining the contact potential difference of a wafer surface using a non-vibrating contact potential difference probe and a vibrating contact potential difference probe. The method and system involves scanning the wafer surface with a non-vibrating contact potential difference sensor, integrating and scaling the resulting data, and applying offsets to individual tracks of data to match the integrated scaled data to measurements made using a vibrating contact potential difference sensor.
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Inventors:
Schulze Mark A
Athlete William Earl
Athlete William Earl
Application Number:
JP2011507577A
Publication Date:
April 24, 2013
Filing Date:
April 28, 2009
Export Citation:
Assignee:
Qcept Technologies, Inc.
International Classes:
G01N27/00
Foreign References:
| WO2006098925A1 |
Other References:
A.Danel et al.,Imaging of contamination on wafers using a scanning surface potential difference measurement technique,Qcept Technologies SEMATECH Surface Preparation and Cleaning Conference,2008年 4月,pp.1-18
Attorney, Agent or Firm:
Koichi Tsujii
Sadao Kumakura
Fumiaki Otsuka
Takaki Nishijima
Hiroyuki Suda
Hiroshi Uesugi
Sadao Kumakura
Fumiaki Otsuka
Takaki Nishijima
Hiroyuki Suda
Hiroshi Uesugi