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Patent Searching and Data


Title:
保温装置及びそれを備えた分析装置
Document Type and Number:
Japanese Patent JP5280984
Kind Code:
B2
Abstract:
The present invention provides a heat retaining device for solving problematic adhesion of a container to the heat retaining device. The heat retaining device includes a supporting rod, a top plate, a bottom plate, a heat retaining body, and a supporting spring. A pressing force applied to the container contained in the hole of the heat retaining body compresses the supporting spring to move the heat retaining body downward along the supporting rod. Release of the pressing force moves the heat retaining body upward by an elastic force of the supporting spring until the heat retaining body comes into contact with the top plate.

Inventors:
Akimasa Osaka
Minoru Sano
Hideo Kanno
Root cause
Yoshiyuki Shoji
Application Number:
JP2009244768A
Publication Date:
September 04, 2013
Filing Date:
October 23, 2009
Export Citation:
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Assignee:
Hitachi High-Technologies Corporation
International Classes:
G01N35/00; C12M1/00
Domestic Patent References:
JP60011958A
JP2001149801A
JP7151764A
JP6245771A
JP6153901A
JP6023203A
JP2121134U
Attorney, Agent or Firm:
Yusuke Hiraki