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Title:
電子部品の実装構造
Document Type and Number:
Japanese Patent JP5385682
Kind Code:
B2
Abstract:
An electronic component (chip) mounted structure includes a chip having a terminal, a wiring board having a terminal electrically connected to the terminal of the chip, and an interposing board disposed between the chip and the wiring board and having a structure including an insulating base material provided with a large number of filamentous conductors penetrating the insulating base material in a thickness direction thereof. The terminal of the chip is electrically connected to the terminal of the wiring board via a plurality of filamentous conductors provided in the interposing board.

Inventors:
小林 壮
堀内 道夫
清水 幸男
徳武 安衛
Application Number:
JP2009120634A
Publication Date:
January 08, 2014
Filing Date:
May 19, 2009
Export Citation:
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Assignee:
新光電気工業株式会社
International Classes:
H01L23/32; H01L21/60; H01L23/12; H01L23/13
Domestic Patent References:
JP4296036A
JP2008270158A
JP2001144511A
JP2000243147A
JP62234804A
JP4087213A
JP2001156209A
JP2002261455A
Attorney, Agent or Firm:
岡本 啓三



 
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