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Patent Searching and Data


Title:
基板検査装置
Document Type and Number:
Japanese Patent JP5400107
Kind Code:
B2
Abstract:
A board inspection apparatus includes an irradiation unit, an imaging unit, and an image processing unit. The image processing unit includes a three-dimensional measurement unit configured to perform three-dimensional measurement of the surfaces of the solder and the resist film by a certain three-dimensional measurement method based on the image data, a virtual standard surface setting unit configured to set a virtual standard surface corresponding to a contacting surface of a certain component mounted in a certain area of the printed board, a protrusion amount calculation unit configured to calculate a protrusion amount from the virtual standard surface for each solder printed and formed in the certain area, and a determination unit configured to determine whether the printed state of the solder passes or fails based on each of the protrusion amounts of the solder.

Inventors:
Hiroyuki Ishigaki
Application Number:
JP2011177797A
Publication Date:
January 29, 2014
Filing Date:
August 16, 2011
Export Citation:
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Assignee:
CKD, Inc.
International Classes:
G01B11/25; G01N21/956; H05K3/34
Attorney, Agent or Firm:
Mitsuo Kawaguchi