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Title:
発光装置及びその製造方法並びに成形体及び封止部材
Document Type and Number:
Japanese Patent JP5422121
Kind Code:
B2
Abstract:
Disclosed is a light-emitting device comprising a light-emitting element (10) composed of a gallium nitride compound semiconductor having an emission peak wavelength of not less than 430 nm; a molded body (40) provided with a recessed portion having a bottom surface on which the light-emitting element (10) is mounted and a lateral surface; and a sealing member (50) containing an epoxy resin including a triazine derivative epoxy resin, or a silicon-containing resin. The molded body (40) is obtained by using a cured product of a thermosetting epoxy resin composition essentially containing an epoxy resin including a triazine derivative epoxy resin, and has a reflectance of not less than 70% at the wavelengths of not less than 430 nm.

Inventors:
Masashi Kuramoto
Tomohide Miki
Tomoya Tsukioka
Kishimoto Tomohisa
Application Number:
JP2007529235A
Publication Date:
February 19, 2014
Filing Date:
July 28, 2006
Export Citation:
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Assignee:
Nichia Corporation
International Classes:
H01L33/48; B29C45/02; B29C45/14; C08G59/20; C08L63/00; H01L33/56
Domestic Patent References:
JP2001342326A2001-12-14
JP2001234032A2001-08-28
JP2002302533A2002-10-18
JP2005159090A2005-06-16
JP2003309229A2003-10-31
JP2003209286A2003-07-25
JP2002030133A2002-01-31
JPH06179737A1994-06-28
JP2005146191A2005-06-09
Attorney, Agent or Firm:
Takashi Kojima
Saori Shigematsu
Katsunari Kobayashi
Takeshi Ishikawa



 
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