Title:
複数ゾーンへのスラリー配送を伴う化学機械研摩
Document Type and Number:
Japanese Patent JP5450613
Kind Code:
B2
Abstract:
Chemical-mechanical polishing or planarization (CMP) is enhanced with multi-zone slurry delivery. A polishing pad is provided that contacts with the work piece, and a multi-zone platen is displaced proximate to the polishing pad to facilitate slurry delivery. The platen includes multiple fluid distribution layers that each include a fluid-distributing channel extending from a fluid source to a distribution point on layer. The distribution points on each of the fluid distribution layers correspond to different locations on the polishing surface to thereby create multiple fluid-delivery zones on the pad.
Inventors:
Omoor, Fergal
Schulz, Steve
Schulz, Steve
Application Number:
JP2011514729A
Publication Date:
March 26, 2014
Filing Date:
June 15, 2009
Export Citation:
Assignee:
NOVELLUS SYSTEMS INCORPORATED
International Classes:
B24B37/00; B24B37/20; H01L21/304
Domestic Patent References:
| JP2004082270A | ||||
| JP11170162A | ||||
| JP11285962A | ||||
| JP10094965A |
Attorney, Agent or Firm:
Meisei International Patent Office
Hidehiko Nakamura
Hidehiko Nakamura