Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
弛張発振回路
Document Type and Number:
Japanese Patent JP5456736
Kind Code:
B2
Inventors:
Seiichiro Shiga
Tetsuya Hirose
Large saki
Application Number:
JP2011185043A
Publication Date:
April 02, 2014
Filing Date:
August 26, 2011
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
Semiconductor Science and Engineering Research Center Co., Ltd.
International Classes:
H03K3/0231; H03K3/354; H03K4/08
Domestic Patent References:
JP2001203563A
Attorney, Agent or Firm:
Takuji Yamada
Mitsuo Tanaka
Kawabata Junichi