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Title:
コイルとこれを備えた加熱部材及び半導体組立システム
Document Type and Number:
Japanese Patent JP5528063
Kind Code:
B2
Inventors:
李 光 鎔
金 民 一
李 種 基
洪 志 碩
禹 賢 貞
Application Number:
JP2009257601A
Publication Date:
June 25, 2014
Filing Date:
November 11, 2009
Export Citation:
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Assignee:
Samsung Electronics Co.,Ltd.
International Classes:
H05B6/36; B23K1/00; B23K1/002; F27D11/06; H01L21/60; H05K3/34; B23K101/42
Domestic Patent References:
JP57155694U
JP2000260815A
JP2005150142A
JP200736110A
JP2003148873A
JP8236529A
JP9097973A
JP2007142343A
JP2001257458A
Attorney, Agent or Firm:
特許業務法人共生国際特許事務所