Title:
積層型半導体装置の製造方法と製造装置
Document Type and Number:
Japanese Patent JP5537515
Kind Code:
B2
Abstract:
After formation of an opening by exposing and development of the photosensitive surface protection film and adhesive layer which is formed on the circuit side of the semiconductor wafer, the semiconductor chips having a photosensitive surface protection film and adhesive layer thereon is fabricated by cutting individual chips from the semiconductor wafer. After the second semiconductor chip is placed over the first semiconductor chip up by the suction collet, the second semiconductor chip is bonded with the first semiconductor chip by the first surface protection film and adhesive layer. The suction side of the suction collet has lower adhesion to the second semiconductor chip than that between the now bonded semiconductor chips.
Inventors:
Atsushi Yoshimura
Naoko Omizo
Naoko Omizo
Application Number:
JP2011190810A
Publication Date:
July 02, 2014
Filing Date:
September 01, 2011
Export Citation:
Assignee:
Toshiba Corporation
International Classes:
H01L25/065; H01L25/07; H01L25/18
Domestic Patent References:
| JP2004022996A | ||||
| JP2010077389A | ||||
| JP6020092B2 | ||||
| JP2005243910A |
Attorney, Agent or Firm:
Patent Business Corporation Sakura International Patent Office