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Document Type and Number:
Japanese Patent JP5556577
Kind Code:
PROBLEM TO BE SOLVED: To provide a copper bonding wire having high conductivity, soft characteristics, and excellent fatigue characteristics at low cost, and to provide a method of manufacturing the same.SOLUTION: The copper bonding wire contains copper and an additive element selected from a group consisting of Ti, Mg, Zr, Nb, Ca, V, Ni, Mn, and Cr, and the remainder of inevitable impurities. The copper bonding wire has a surface layer where the unprocessed crystal structure has an average crystal grain size of 20 μm or less from the surface down to a depth of 50 μm.

Hiromitsu Kuroda
Toru Sumi
Sakawa Hideyuki
Aoyama Justice
Application Number:
Publication Date:
July 23, 2014
Filing Date:
October 20, 2010
Export Citation:
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Hitachi Metals, Ltd.
International Classes:
H01L21/60; C22C9/00
Attorney, Agent or Firm:
Tadao Hirata
Kenji Tsunoda
Yuji Iwanaga
Keiko Nakamura
Endo Wako
Takashi Nomiyama
Now Tomoji

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