Title:
半導体装置
Document Type and Number:
Japanese Patent JP5607782
Kind Code:
B2
Inventors:
Hiroshi Yamashita
Application Number:
JP2013087146A
Publication Date:
October 15, 2014
Filing Date:
April 18, 2013
Export Citation:
Assignee:
ルネサス electronics incorporated company
International Classes:
H01L23/50; H01L23/12
Attorney, Agent or Firm:
Shinji Hayami
Amagi 聡
Amagi 聡