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Title:
半導体素子接合用の貴金属ペースト
Document Type and Number:
Japanese Patent JP5613253
Kind Code:
B2
Abstract:
A precious metal paste which does not cause contamination of a member, which can be uniformly coated to a member to be bonded, and which is in good condition after bonding is provided. The present invention relates to a precious metal paste for bonding a semiconductor element, of the paste including a precious metal powder and an organic solvent, in which the precious metal powder has a purity of 99.9 mass% or more and an average particle diameter of 0.1 to 0.5 µm, the organic solvent has a boiling point of 200 to 350°C, and a thixotropy index (TI) value calculated from a measurement value of a viscosity at a shear rate of 4/s with respect to a viscosity at a shear rate of 40/s at 23°C by means of a rotational viscometer is 6.0 or more.

Inventors:
宮入 正幸
秋山 伸之
稲垣 克二
小柏 俊典
Application Number:
JP2012537672A
Publication Date:
October 22, 2014
Filing Date:
September 30, 2011
Export Citation:
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Assignee:
田中貴金属工業株式会社
International Classes:
H01B1/22; C09J1/00; C09J9/02; H01L21/52
Domestic Patent References:
JPH06263917A1994-09-20
JP2006032936A2006-02-02
JP2007324523A2007-12-13
JP2008028364A2008-02-07
JP2001181482A2001-07-03
JP2009185112A2009-08-20
Attorney, Agent or Firm:
Patent business corporation Tanaka and Okazaki and associates