Title:
半導体部品用実装装置
Document Type and Number:
Japanese Patent JP5647652
Kind Code:
B2
Abstract:
A semiconductor component mounting apparatus includes an image sensing unit, electrode detection unit, and determination unit. The image sensing unit is configured to obtain image data of a plurality of electrodes arranged on a mounting surface of a semiconductor component. The electrodes are divided into a plurality of groups based upon functions of the electrodes. The electrode detection unit is configured to identify the electrodes in each of the groups, and to detect, for each of the electrodes, whether the electrode is lacking or not by using the image data. Each of the groups has a preset permissible number of lacking electrodes. The determination unit is configured to determine, based on the number of the lacking electrodes detected by the electrode detection unit and the permissible number of lacking electrodes preset to the group, whether the semiconductor component is a defective or a non-defective.
Inventors:
加藤 寛
尾身 幸治
尾身 幸治
Application Number:
JP2012186294A
Publication Date:
January 07, 2015
Filing Date:
August 27, 2012
Export Citation:
Assignee:
ヤマハ発動機株式会社
International Classes:
H05K13/04; H01L21/60; H05K13/08
Attorney, Agent or Firm:
Masaki Yamakawa
Shigeki Yamakawa
Shigeki Yamakawa