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Patent Searching and Data


Title:
真空処理装置内の基板の温度を測定するための方法及びデバイス
Document Type and Number:
Japanese Patent JP5676682
Kind Code:
B2
Inventors:
李 有森
李 ▲天▼笑
▲陳▼ 志浩
Application Number:
JP2013096785A
Publication Date:
February 25, 2015
Filing Date:
May 02, 2013
Export Citation:
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Assignee:
中微半▲導▼体▲設▼▲備▼(上海)有限公司
International Classes:
H01L21/205; C23C16/52; G01J5/00; H01L21/3065; H01L21/365
Attorney, Agent or Firm:
Yasuhiko Murayama
Masatake Shiga
Takashi Watanabe
Shinya Jitsuhiro