Title:
移動体装置、露光装置、及びデバイス製造方法
Document Type and Number:
Japanese Patent JP5725059
Kind Code:
B2
Abstract:
Power-transmitting, waste-heat frames (24A, 24B) can continually absorbs heat radiated from wafer stages (WST1, WST2), and therefore it becomes possible to suppress adverse influence on exposure accuracy due to the heat generated at the wafer stages (WST1, WST2). In this case, unlike the conventional method, it is not necessary to connect a conduit (tube) for supplying coolant to the wafer stages (WST1, WST2) from the outside, and accordingly declines in movement accuracy of the wafer stages (WST1, WST2) due to tension of such a conduit can be prevented. Also from this standpoint, the exposure accuracy can be maintained at high accuracy.
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Inventors:
Keiichi Tanaka
Application Number:
JP2013046987A
Publication Date:
May 27, 2015
Filing Date:
March 08, 2013
Export Citation:
Assignee:
NIKON CORPORATION
International Classes:
H01L21/027; G03F7/20; H01L21/68
Domestic Patent References:
| JP2003022960A | ||||
| JP2002057099A | ||||
| JP2004342987A | ||||
| JP2003058258A | ||||
| JP2005209997A | ||||
| JP7270122A | ||||
| JP2003280744A |
Attorney, Agent or Firm:
Atsushi Tateishi