Title:
硬化性シリコーン樹脂組成物、その硬化物及び光半導体デバイス
Document Type and Number:
Japanese Patent JP5751214
Kind Code:
B2
Abstract:
A curable silicone resin composition is provided comprising (A) a linear organopolysiloxane having at least two aliphatic unsaturated radicals and optionally, an organopolysiloxane of branched or three-dimensional network structure, (B) an organohydrogenpolysiloxane having at least two SiH radicals and free of aliphatic unsaturation, (C) a hydrosilylation catalyst, and (D) silicone powder having an average particle size of 0.5-100 µm. The composition is suitable for LED encapsulation.
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Inventors:
Satoshi Kouchi
Application Number:
JP2012136714A
Publication Date:
July 22, 2015
Filing Date:
June 18, 2012
Export Citation:
Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
C08G77/50; C08L83/07; C08L83/04; C08L83/05; H01L23/29; H01L23/31
Domestic Patent References:
| JP2010003848A | ||||
| JP2011148981A |
Attorney, Agent or Firm:
Takashi Kojima
Saori Shigematsu
Katsunari Kobayashi
Takeshi Ishikawa
Saori Shigematsu
Katsunari Kobayashi
Takeshi Ishikawa