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Patent Searching and Data


Title:
マルチダイパッケージ内でのルールベースの半導体ダイのスタッキングおよびボンディング
Document Type and Number:
Japanese Patent JP5813014
Kind Code:
B2
Abstract:
A rule-based method of optimizing wire bonding jumps is disclosed which minimizes the amount of wire used for wire bonds and/or minimizes a number of power and ground pads on a substrate to support all wired connections.

Inventors:
ウー チャールズ ハング シアング
Application Number:
JP2012552134A
Publication Date:
November 17, 2015
Filing Date:
February 07, 2011
Export Citation:
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Assignee:
SanDisk Technologies,Inc.
International Classes:
H01L25/065; H01L25/07; H01L25/18
Domestic Patent References:
JP2007019415A
JP2008515203A
JP2001024151A
JP2002050737A
JP2003060053A
JP2004349694A
JP6291250A
Foreign References:
WO1998025271A1
Attorney, Agent or Firm:
特許業務法人快友国際特許事務所