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Patent Searching and Data


Title:
面発光半導体装置によるデジタル熱注入
Document Type and Number:
Japanese Patent JP5827569
Kind Code:
B2
Abstract:
A method and system are provided for digitally injecting heat into a wide range of products by way of incorporation of a special class of semi-conductor lasers, e.g. surface emitting devices. This technique relates to a more specific, economical, and advantageous way of practicing the art of directly injecting narrowband radiant energy that desirously matches the absorption specification of a particular material at a specified wavelength.

Inventors:
コクラン,ドン,ダブリュー.
ジョンソン,ベンジャミン,ディー.
カッツ,ジョナサン,エム.
ムーア,マーク,ダブリュー.
モーガン,ノエル,イー.
ロス,デンウッド,エフ.
Application Number:
JP2011553159A
Publication Date:
December 02, 2015
Filing Date:
March 05, 2010
Export Citation:
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Assignee:
PRESSCO TECHNOLOGY INC.
International Classes:
H01S5/42; B29B13/02; F24C7/04; H01S5/024
Domestic Patent References:
JP2008521662A
JP2002026452A
JP2008124358A
JP2002535159A
JP2002109769A
Attorney, Agent or Firm:
菊間 忠之