面発光半導体装置によるデジタル熱注入

Title:

面発光半導体装置によるデジタル熱注入

Document Type and Number:

Japanese Patent JP5827569

Kind Code:

B2

Abstract:

A method and system are provided for digitally injecting heat into a wide range of products by way of incorporation of a special class of semi-conductor lasers, e.g. surface emitting devices. This technique relates to a more specific, economical, and advantageous way of practicing the art of directly injecting narrowband radiant energy that desirously matches the absorption specification of a particular material at a specified wavelength.

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Inventors:

COCHRAN,Don,W.
Johnson, Benjamin, Dee.
Katz, Jonathan, M.
Moore, Mark, W.
Morgan, Noel, Yi.
Ross, Denwood, F.

Application Number:

JP2011553159A

Publication Date:

December 02, 2015

Filing Date:

March 05, 2010

Export Citation:

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Assignee:

PRESSCO TECHNOLOGY INC.

International Classes:

H01S5/42; B29B13/02; F24C7/04; H01S5/024; H01S5/18

Domestic Patent References:

JP2008521662A
JP2002026452A
JP2008124358A
JP2002535159A
JP2002109769A

Attorney, Agent or Firm:

Tadayuki Kikuma

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